- List
- Wassenaar Arrangement – List of Dual-Use Goods and Technologies – WA-LIST (25) 1
- Corresponding EU entry
- 2E003
a. Not used since 2017
b. "Technology" for metal-working manufacturing processes, as follows:
1. "Technology" for the design of tools, dies or fixtures specially designed for any of the following processes:
a. "Superplastic forming";
b. "Diffusion bonding"; or
c. 'Direct-acting hydraulic pressing';
Technical Note
For the purposes of 2.E.3.b.1.c., 'direct-acting hydraulic pressing' is a deformation process which uses a fluid-filled flexible bladder in direct contact with the workpiece.
b. 2. Not used since 2020
N.B. For "technology" for metal-working manufacturing processes for gas turbine engines and components, see 9.E.3. and ML22.
c. "Technology" for the "development" or "production" of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;
d. Not used since 2017
e. "Technology" for the "development" of integration "software" for incorporation of expert systems for advanced decision support of shop floor operations into "numerical control" units;
f. "Technology" for the application of inorganic overlay coatings or inorganic surface modification coatings (specified in column 3 of the following table) to non-electronic substrates (specified in column 2 of the following table), by processes specified in column 1 of the following table and defined in the Technical Note.
N.B. This Table should be read to specify the "technology" for a particular 'Coating Process' only when the Resultant Coating in column 3 is in a paragraph directly across from the relevant 'Substrate' under column 2. For example, Chemical Vapour Deposition (CVD) 'coating process' technical data are included for the application of 'silicides' to 'Carbon-carbon, Ceramic and Metal "matrix" "composites"' substrates, but are not included for the application of 'silicides' to 'Cemented tungsten carbide (16), Silicon carbide (18)' substrates. In the second case, the resultant coating is not listed in the paragraph under column 3 directly across from the paragraph under column 2 listing 'Cemented tungsten carbide (16), Silicon carbide (18)'.
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1)[3] 2. Substrate 3. Resultant Coating
A. Chemical Vapour "Superalloys" Aluminides for internal
Deposition (CVD) passages
Ceramics (19) and Low- Silicides
expansion glasses (14) Carbides
Dielectric layers (15)
Diamond
Diamond-like carbon (17)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Aluminides
Alloyed aluminides (2)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys Diamond
Diamond-like carbon (17)
Sensor window Dielectric layers (15)
materials (9) Diamond
Diamond-like carbon (17)
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B. Thermal-Evaporation
Physical Vapour
Deposition (TE-PVD)
B.1. Physical Vapour "Superalloys" Alloyed silicides
Deposition (PVD): Alloyed aluminides (2)
Electron-Beam MCrAlX (5)
(EB-PVD) Modified zirconia (12)
Silicides
Aluminides
Mixtures thereof (4)
Ceramics (19) and Low- Dielectric layers (15)
expansion glasses (14)
Corrosion resistant MCrAlX (5)
steel (7) Modified zirconia (12)
Mixtures thereof (4)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys Borides
Beryllium
Sensor window Dielectric layers (15)
materials (9)
Titanium alloys (13) Borides
Nitrides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.2. Ion assisted resistive Ceramics (19) and Low- Dielectric layers (15)
heating Physical Vapour expansion glasses (14) Diamond-like carbon (17)
Deposition (PVD)
(Ion Plating)
Carbon-carbon, Dielectric layers (15)
Ceramic and Metal
"matrix" "composites"
Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and
Beryllium alloys Dielectric layers (15)
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
___________________________________________________________________________
B.3. Physical Vapour Ceramics (19) and Low- Silicides
Deposition (PVD): expansion glasses (14) Dielectric layers (15)
"Laser" Vaporization Diamond-like carbon (17)
Carbon-carbon, Dielectric layers (15)
Ceramic and Metal
"matrix" "composites"
Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.4. Physical Vapour "Superalloys" Alloyed silicides
Deposition (PVD): Alloyed aluminides (2)
Cathodic Arc Discharge MCrAlX (5)
Polymers (11) and Borides
Organic "matrix" Carbides
"composites" Nitrides
Diamond-like carbon (17)
___________________________________________________________________________
C. Pack cementation Carbon-carbon, Silicides
(see A above for Ceramic and Carbides
out-of-pack Metal "matrix" Mixtures thereof (4)
cementation) (10) "composites"
Titanium alloys (13) Silicides
Aluminides
Alloyed aluminides (2)
Refractory metals Silicides
and alloys (8) Oxides
___________________________________________________________________________
D. Plasma spraying "Superalloys" MCrAlX (5)
Modified zirconia (12)
Mixtures thereof (4)
Abradable Nickel-Graphite
Abradable materials
containing Ni-Cr-Al
Abradable Al-Si-Polyester
Alloyed aluminides (2)
Aluminium alloys (6) MCrAlX (5)
Modified zirconia (12)
Silicides
Mixtures thereof (4)
Refractory metals Aluminides
and alloys (8) Silicides
Carbides
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
D. (continued) Corrosion resistant MCrAlX (5)
steel (7) Modified zirconia (12)
Mixtures thereof (4)
Titanium alloys (13) Carbides
Aluminides
Silicides
Alloyed aluminides (2)
Abradable Nickel-Graphite
Abradable materials
containing Ni-Cr-Al
Abradable Al-Si-Polyester
___________________________________________________________________________
E. Slurry Deposition Refractory metals Fused silicides
and alloys (8) Fused aluminides
except for resistance
heating elements
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Mixtures thereof (4)
"composites"
___________________________________________________________________________
F. Sputter Deposition "Superalloys" Alloyed silicides
Alloyed aluminides (2)
Noble metal modified
aluminides (3)
MCrAlX (5)
Modified zirconia (12)
Platinum
Mixtures thereof (4)
Ceramics and Low- Silicides
expansion glasses (14) Platinum
Mixtures thereof (4)
Dielectic layers (15)
Diamond-like carbon (17)
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
F. (continued) Titanium alloys (13) Borides
Nitrides
Oxides
Silicides
Aluminides
Alloyed aluminides (2)
Carbides
Carbon-carbon, Silicides
Ceramic and Metal Carbides
"matrix" "composites" Refractory metals
Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and Borides
Beryllium alloys Dielectric layers (15)
Beryllium
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
Refractory metals Aluminides
and alloys (8) Silicides
Oxides
Carbides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
G. Ion Implantation High temperature Additions of
bearing steels Chromium
Tantalum or
Niobium (Columbium)
Titanium alloys (13) Borides
Nitrides
Beryllium and Borides
Beryllium alloys
Cemented tungsten Carbides
carbide (16) Nitrides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES - NOTES
1. The term 'coating process' includes coating repair and refurbishing as well as original coating.
2. The term 'alloyed aluminide coating' includes single or multiple-step coatings in which an element or elements are deposited prior to or during application of the aluminide coating, even if these elements are deposited by another coating process. It does not, however, include the multiple use of single-step pack cementation processes to achieve alloyed aluminides.
3. The term 'noble metal modified aluminide' coating includes multiple-step coatings in which the noble metal or noble metals are laid down by some other coating process prior to application of the aluminide coating.
4. The term 'mixtures thereof' includes infiltrated material, graded compositions, co-deposits and multilayer deposits and are obtained by one or more of the coating processes specified in the Table.
5. 'MCrAlX' refers to a coating alloy where M equals cobalt, iron, nickel or combinations thereof and X equals hafnium, yttrium, silicon, tantalum in any amount or other intentional additions over 0.01% by weight in various proportions and combinations, except:
a. CoCrAlY coatings which contain less than 22% by weight of chromium, less than 7% by weight of aluminium and less than 2% by weight of yttrium;
b. CoCrAlY coatings which contain 22 to 24% by weight of chromium, 10 to 12% by weight of aluminium and 0.5 to 0.7% by weight of yttrium; or
c. NiCrAlY coatings which contain 21 to 23% by weight of chromium, 10 to 12% by weight of aluminium and 0.9 to 1.1% by weight of yttrium.
6. The term 'aluminium alloys' refers to alloys having an ultimate tensile strength of 190 MPa or more measured at 293 K (20°C).
7. The term 'corrosion resistant steel' refers to AISI (American Iron and Steel Institute) 300 series or equivalent national standard steels.
8. 'Refractory metals and alloys' include the following metals and their alloys: niobium (columbium), molybdenum, tungsten and tantalum.
9. 'Sensor window materials', as follows: alumina, silicon, germanium, zinc sulphide, zinc selenide, gallium arsenide, diamond, gallium phosphide, sapphire and the following metal halides: sensor window materials of more than 40 mm diameter for zirconium fluoride and hafnium fluoride.
TABLE - DEPOSITION TECHNIQUES – NOTES
10. Category 2 does not include "technology" for single-step pack cementation of solid aerofoils.
11. 'Polymers', as follows: polyimide, polyester, polysulphide, polycarbonates and polyurethanes.
12. 'Modified zirconia' refers to additions of other metal oxides (e.g., calcia, magnesia, yttria, hafnia, rare earth oxides) to zirconia in order to stabilise certain crystallographic phases and phase compositions. Thermal barrier coatings made of zirconia, modified with calcia or magnesia by mixing or fusion, are not included.
13. 'Titanium alloys' refers only to aerospace alloys having an ultimate tensile strength of 900 MPa or more measured at 293 K (20°C).
14. 'Low-expansion glasses' refers to glasses which have a coefficient of thermal expansion of 1 x 10⁻⁷ K⁻¹ or less measured at 293 K (20°C).
15. 'Dielectric layers' are coatings constructed of multi-layers of insulator materials in which the interference properties of a design composed of materials of various refractive indices are used to reflect, transmit or absorb various wavelength bands. Dielectric layers refers to more than four dielectric layers or dielectric/metal "composite" layers.
16. 'Cemented tungsten carbide' does not include cutting and forming tool materials consisting of tungsten carbide/(cobalt, nickel), titanium carbide/(cobalt, nickel), chromium carbide/nickel-chromium and chromium carbide/nickel.
17. "Technology" for depositing diamond-like carbon on any of the following is not included:
magnetic disk drives and heads, equipment for the manufacture of disposables, valves for faucets, acoustic diaphragms for speakers, engine parts for automobiles, cutting tools, punching-pressing dies, office automation equipment, microphones, medical devices or moulds, for casting or moulding of plastics, manufactured from alloys containing less than 5% beryllium.
18. 'Silicon carbide' does not include cutting and forming tool materials.
19. Ceramic substrates, as used in this entry, does not include ceramic materials containing 5% by weight, or greater, clay or cement content, either as separate constituents or in combination.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table are defined as follows:
a. Chemical Vapour Deposition (CVD) is an overlay coating or surface modification coating process wherein a metal, alloy, "composite", dielectric or ceramic is deposited upon a heated substrate. Gaseous reactants are decomposed or combined in the vicinity of a substrate resulting in the deposition of the desired elemental, alloy or compound material on the substrate. Energy for this decomposition or chemical reaction process may be provided by the heat of the substrate, a glow discharge plasma, or "laser" irradiation.
N.B.1. CVD includes the following processes: directed gas flow out-of-pack deposition, pulsating CVD, Controlled Nucleation Thermal Deposition (CNTD), plasma enhanced or plasma assisted CVD processes.
N.B.2. Pack denotes a substrate immersed in a powder mixture.
N.B.3. The gaseous reactants used in the out-of-pack process are produced using the same basic reactions and parameters as the pack cementation process, except that the substrate to be coated is not in contact with the powder mixture.
b. Thermal Evaporation-Physical Vapour Deposition (TE-PVD) is an overlay coating process conducted in a vacuum with a pressure less than 0.1 Pa wherein a source of thermal energy is used to vaporize the coating material. This process results in the condensation, or deposition, of the evaporated species onto appropriately positioned substrates.
The addition of gases to the vacuum chamber during the coating process to synthesize compound coatings is an ordinary modification of the process.
The use of ion or electron beams, or plasma, to activate or assist the coating's deposition is also a common modification in this technique. The use of monitors to provide in-process measurement of optical characteristics and thickness of coatings can be a feature of these processes.
Specific TE-PVD processes are as follows:
1. Electron Beam-Physical Vapour Deposition (EB-PVD) uses an electron beam to heat and evaporate the material which forms the coating;
2. Ion Assisted Resistive Heating PVD employs electrically resistive heating sources in combination with impinging ion beam(s) to produce a controlled and uniform flux of evaporated coating species;
3. "Laser" Vaporization uses either pulsed or continuous wave "laser" beams to vaporize the material which forms the coating;
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
b. 4. Cathodic Arc Deposition employs a consumable cathode of the material which forms the coating and has an arc discharge established on the surface by a momentary contact of a ground trigger. Controlled motion of arcing erodes the cathode surface creating a highly ionized plasma. The anode can be either a cone attached to the periphery of the cathode, through an insulator, or the chamber. Substrate biasing is used for non line-of-sight deposition;
N.B. This definition does not include random cathodic arc deposition with non-biased substrates.
5. Ion Plating is a special modification of a general TE-PVD process in which a plasma or an ion source is used to ionize the species to be deposited, and a negative bias is applied to the substrate in order to facilitate the extraction of the species from the plasma. The introduction of reactive species, evaporation of solids within the process chamber, and the use of monitors to provide in-process measurement of optical characteristics and thicknesses of coatings are ordinary modifications of the process.
c. Pack Cementation is a surface modification coating or overlay coating process wherein a substrate is immersed in a powder mixture (a pack), that consists of:
1. The metallic powders that are to be deposited (usually aluminium, chromium, silicon or combinations thereof);
2. An activator (normally a halide salt); and
3. An inert powder, most frequently alumina.
The substrate and powder mixture is contained within a retort which is heated to between 1,030 K (757°C) and 1,375 K (1,102°C) for sufficient time to deposit the coating.
d. Plasma Spraying is an overlay coating process wherein a gun (spray torch) which produces and controls a plasma accepts powder or wire coating materials, melts them and propels them towards a substrate, whereon an integrally bonded coating is formed. Plasma spraying constitutes either low pressure plasma spraying or high velocity plasma spraying.
N.B.1. Low pressure means less than ambient atmospheric pressure.
N.B.2. High velocity refers to nozzle-exit gas velocity exceeding 750 m/s calculated at 293 K (20°C) at 0.1 MPa.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
e. Slurry Deposition is a surface modification coating or overlay coating process wherein a metallic or ceramic powder with an organic binder is suspended in a liquid and is applied to a substrate by either spraying, dipping or painting, subsequent air or oven drying, and heat treatment to obtain the desired coating.
f. Sputter Deposition is an overlay coating process based on a momentum transfer phenomenon, wherein positive ions are accelerated by an electric field towards the surface of a target (coating material). The kinetic energy of the impacting ions is sufficient to cause target surface atoms to be released and deposited on an appropriately positioned substrate.
N.B.1. The Table refers only to triode, magnetron or reactive sputter deposition which is used to increase adhesion of the coating and rate of deposition and to radio frequency (RF) augmented sputter deposition used to permit vaporisation of non-metallic coating materials.
N.B.2. Low-energy ion beams (less than 5 keV) can be used to activate the deposition.
g. Ion Implantation is a surface modification coating process in which the element to be alloyed is ionized, accelerated through a potential gradient and implanted into the surface region of the substrate. This includes processes in which ion implantation is performed simultaneously with Electron Beam-Physical Vapour Deposition (EB-PVD) or sputter deposition.
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
It is understood that the following technical information, accompanying the table of deposition techniques, is for use as appropriate.
1. Technical information for pretreatments of the substrates listed in the Table, as follows:
a. Chemical stripping and cleaning bath cycle parameters, as follows:
1. Bath composition
a. For the removal of old or defective coatings, corrosion product or foreign deposits;
b. For preparation of virgin substrates;
2. Time in bath;
3. Temperature of bath;
4. Number and sequences of wash cycles;
b. Visual and macroscopic criteria for acceptance of the cleaned part;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:
a. Composition of the atmosphere;
b. Pressure of the atmosphere;
2. Temperature for heat treatment;
3. Time of heat treatment;
d. Substrate surface preparation parameters, as follows:
1. Grit blasting parameters, as follows:
a. Grit composition;
b. Grit size and shape;
c. Grit velocity;
2. Time and sequence of cleaning cycle after grit blast;
3. Surface finish parameters;
4. Application of binders to promote adhesion;
e. Masking technique parameters, as follows:
1. Material of mask;
2. Location of mask;
2. Technical information for in situ quality assurance techniques for evaluation of the coating processes listed in the Table, as follows:
a. Atmosphere parameters, as follows:
1. Composition of the atmosphere;
2. Pressure of the atmosphere;
b. Time parameters;
c. Temperature parameters;
d. Thickness parameters;
e. Index of refraction parameters;
f. Control of composition;
3. Technical information for post deposition treatments of the coated substrates listed in the Table, as follows:
a. Shot peening parameters, as follows:
1. Shot composition;
2. Shot size;
3. Shot velocity;
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
3. b. Post shot peening cleaning parameters;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:
a. Composition of the atmosphere;
b. Pressure of the atmosphere;
2. Time-temperature cycles;
d. Post heat treatment visual and macroscopic criteria for acceptance of the coated substrates;
4. Technical information for quality assurance techniques for the evaluation of the coated substrates listed in the Table, as follows:
a. Statistical sampling criteria;
b. Microscopic criteria for:
1. Magnification;
2. Coating thickness uniformity;
3. Coating integrity;
4. Coating composition;
5. Coating and substrates bonding;
6. Microstructural uniformity;
c. Criteria for optical properties assessment (measured as a function of wavelength):
1. Reflectance;
2. Transmission;
3. Absorption;
4. Scatter;
5. Technical information and parameters related to specific coating and surface modification processes listed in the Table, as follows:
a. For Chemical Vapour Deposition (CVD):
1. Coating source composition and formulation;
2. Carrier gas composition;
3. Substrate temperature;
4. Time-temperature-pressure cycles;
5. Gas control and part manipulation;
b. For Thermal Evaporation-Physical Vapour Deposition (TE-PVD):
1. Ingot or coating material source composition;
2. Substrate temperature;
3. Reactive gas composition;
4. Ingot feed rate or material vaporisation rate;
5. Time-temperature-pressure cycles;
6. Beam and part manipulation;
7. "Laser" parameters, as follows:
a. Wave length;
b. Power density;
c. Pulse length;
d. Repetition ratio;
e. Source;
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
5. c. For Pack Cementation:
1. Pack composition and formulation;
2. Carrier gas composition;
3. Time-temperature-pressure cycles;
d. For Plasma Spraying:
1. Powder composition, preparation and size distributions;
2. Feed gas composition and parameters;
3. Substrate temperature;
4. Gun power parameters;
5. Spray distance;
6. Spray angle;
7. Cover gas composition, pressure and flow rates;
8. Gun control and part manipulation;
e. For Sputter Deposition:
1. Target composition and fabrication;
2. Geometrical positioning of part and target;
3. Reactive gas composition;
4. Electrical bias;
5. Time-temperature-pressure cycles;
6. Triode power;
7. Part manipulation;
f. For Ion Implantation:
1. Beam control and part manipulation;
2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles;
g. For Ion Plating:
1. Beam control and part manipulation;
2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles;
5. Coating material feed rate and vaporisation rate;
6. Substrate temperature;
7. Substrate bias parameters.
[1] ^(*) The Russian Federation and Ukraine view this list as a reference list drawn up to help in the selection of dual-use goods which could contribute to the indigenous development, production or enhancement of conventional munitions capabilities.
[2] ^(*) The Russian Federation and Ukraine view this list as a reference list drawn up to help in the selection of dual-use goods which could contribute to the indigenous development, production or enhancement of conventional munitions capabilities.
[3] ^(*) The numbers in parenthesis refer to the Notes following this Table.
b. "Technology" for metal-working manufacturing processes, as follows:
1. "Technology" for the design of tools, dies or fixtures specially designed for any of the following processes:
a. "Superplastic forming";
b. "Diffusion bonding"; or
c. 'Direct-acting hydraulic pressing';
Technical Note
For the purposes of 2.E.3.b.1.c., 'direct-acting hydraulic pressing' is a deformation process which uses a fluid-filled flexible bladder in direct contact with the workpiece.
b. 2. Not used since 2020
N.B. For "technology" for metal-working manufacturing processes for gas turbine engines and components, see 9.E.3. and ML22.
c. "Technology" for the "development" or "production" of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;
d. Not used since 2017
e. "Technology" for the "development" of integration "software" for incorporation of expert systems for advanced decision support of shop floor operations into "numerical control" units;
f. "Technology" for the application of inorganic overlay coatings or inorganic surface modification coatings (specified in column 3 of the following table) to non-electronic substrates (specified in column 2 of the following table), by processes specified in column 1 of the following table and defined in the Technical Note.
N.B. This Table should be read to specify the "technology" for a particular 'Coating Process' only when the Resultant Coating in column 3 is in a paragraph directly across from the relevant 'Substrate' under column 2. For example, Chemical Vapour Deposition (CVD) 'coating process' technical data are included for the application of 'silicides' to 'Carbon-carbon, Ceramic and Metal "matrix" "composites"' substrates, but are not included for the application of 'silicides' to 'Cemented tungsten carbide (16), Silicon carbide (18)' substrates. In the second case, the resultant coating is not listed in the paragraph under column 3 directly across from the paragraph under column 2 listing 'Cemented tungsten carbide (16), Silicon carbide (18)'.
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1)[3] 2. Substrate 3. Resultant Coating
A. Chemical Vapour "Superalloys" Aluminides for internal
Deposition (CVD) passages
Ceramics (19) and Low- Silicides
expansion glasses (14) Carbides
Dielectric layers (15)
Diamond
Diamond-like carbon (17)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Aluminides
Alloyed aluminides (2)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys Diamond
Diamond-like carbon (17)
Sensor window Dielectric layers (15)
materials (9) Diamond
Diamond-like carbon (17)
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B. Thermal-Evaporation
Physical Vapour
Deposition (TE-PVD)
B.1. Physical Vapour "Superalloys" Alloyed silicides
Deposition (PVD): Alloyed aluminides (2)
Electron-Beam MCrAlX (5)
(EB-PVD) Modified zirconia (12)
Silicides
Aluminides
Mixtures thereof (4)
Ceramics (19) and Low- Dielectric layers (15)
expansion glasses (14)
Corrosion resistant MCrAlX (5)
steel (7) Modified zirconia (12)
Mixtures thereof (4)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys Borides
Beryllium
Sensor window Dielectric layers (15)
materials (9)
Titanium alloys (13) Borides
Nitrides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.2. Ion assisted resistive Ceramics (19) and Low- Dielectric layers (15)
heating Physical Vapour expansion glasses (14) Diamond-like carbon (17)
Deposition (PVD)
(Ion Plating)
Carbon-carbon, Dielectric layers (15)
Ceramic and Metal
"matrix" "composites"
Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and
Beryllium alloys Dielectric layers (15)
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
___________________________________________________________________________
B.3. Physical Vapour Ceramics (19) and Low- Silicides
Deposition (PVD): expansion glasses (14) Dielectric layers (15)
"Laser" Vaporization Diamond-like carbon (17)
Carbon-carbon, Dielectric layers (15)
Ceramic and Metal
"matrix" "composites"
Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.4. Physical Vapour "Superalloys" Alloyed silicides
Deposition (PVD): Alloyed aluminides (2)
Cathodic Arc Discharge MCrAlX (5)
Polymers (11) and Borides
Organic "matrix" Carbides
"composites" Nitrides
Diamond-like carbon (17)
___________________________________________________________________________
C. Pack cementation Carbon-carbon, Silicides
(see A above for Ceramic and Carbides
out-of-pack Metal "matrix" Mixtures thereof (4)
cementation) (10) "composites"
Titanium alloys (13) Silicides
Aluminides
Alloyed aluminides (2)
Refractory metals Silicides
and alloys (8) Oxides
___________________________________________________________________________
D. Plasma spraying "Superalloys" MCrAlX (5)
Modified zirconia (12)
Mixtures thereof (4)
Abradable Nickel-Graphite
Abradable materials
containing Ni-Cr-Al
Abradable Al-Si-Polyester
Alloyed aluminides (2)
Aluminium alloys (6) MCrAlX (5)
Modified zirconia (12)
Silicides
Mixtures thereof (4)
Refractory metals Aluminides
and alloys (8) Silicides
Carbides
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
D. (continued) Corrosion resistant MCrAlX (5)
steel (7) Modified zirconia (12)
Mixtures thereof (4)
Titanium alloys (13) Carbides
Aluminides
Silicides
Alloyed aluminides (2)
Abradable Nickel-Graphite
Abradable materials
containing Ni-Cr-Al
Abradable Al-Si-Polyester
___________________________________________________________________________
E. Slurry Deposition Refractory metals Fused silicides
and alloys (8) Fused aluminides
except for resistance
heating elements
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Mixtures thereof (4)
"composites"
___________________________________________________________________________
F. Sputter Deposition "Superalloys" Alloyed silicides
Alloyed aluminides (2)
Noble metal modified
aluminides (3)
MCrAlX (5)
Modified zirconia (12)
Platinum
Mixtures thereof (4)
Ceramics and Low- Silicides
expansion glasses (14) Platinum
Mixtures thereof (4)
Dielectic layers (15)
Diamond-like carbon (17)
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
F. (continued) Titanium alloys (13) Borides
Nitrides
Oxides
Silicides
Aluminides
Alloyed aluminides (2)
Carbides
Carbon-carbon, Silicides
Ceramic and Metal Carbides
"matrix" "composites" Refractory metals
Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide (18) Mixtures thereof (4)
Dielectric layers (15)
Boron nitride
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and Borides
Beryllium alloys Dielectric layers (15)
Beryllium
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon (17)
Refractory metals Aluminides
and alloys (8) Silicides
Oxides
Carbides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
G. Ion Implantation High temperature Additions of
bearing steels Chromium
Tantalum or
Niobium (Columbium)
Titanium alloys (13) Borides
Nitrides
Beryllium and Borides
Beryllium alloys
Cemented tungsten Carbides
carbide (16) Nitrides
___________________________________________________________________________
TABLE - DEPOSITION TECHNIQUES - NOTES
1. The term 'coating process' includes coating repair and refurbishing as well as original coating.
2. The term 'alloyed aluminide coating' includes single or multiple-step coatings in which an element or elements are deposited prior to or during application of the aluminide coating, even if these elements are deposited by another coating process. It does not, however, include the multiple use of single-step pack cementation processes to achieve alloyed aluminides.
3. The term 'noble metal modified aluminide' coating includes multiple-step coatings in which the noble metal or noble metals are laid down by some other coating process prior to application of the aluminide coating.
4. The term 'mixtures thereof' includes infiltrated material, graded compositions, co-deposits and multilayer deposits and are obtained by one or more of the coating processes specified in the Table.
5. 'MCrAlX' refers to a coating alloy where M equals cobalt, iron, nickel or combinations thereof and X equals hafnium, yttrium, silicon, tantalum in any amount or other intentional additions over 0.01% by weight in various proportions and combinations, except:
a. CoCrAlY coatings which contain less than 22% by weight of chromium, less than 7% by weight of aluminium and less than 2% by weight of yttrium;
b. CoCrAlY coatings which contain 22 to 24% by weight of chromium, 10 to 12% by weight of aluminium and 0.5 to 0.7% by weight of yttrium; or
c. NiCrAlY coatings which contain 21 to 23% by weight of chromium, 10 to 12% by weight of aluminium and 0.9 to 1.1% by weight of yttrium.
6. The term 'aluminium alloys' refers to alloys having an ultimate tensile strength of 190 MPa or more measured at 293 K (20°C).
7. The term 'corrosion resistant steel' refers to AISI (American Iron and Steel Institute) 300 series or equivalent national standard steels.
8. 'Refractory metals and alloys' include the following metals and their alloys: niobium (columbium), molybdenum, tungsten and tantalum.
9. 'Sensor window materials', as follows: alumina, silicon, germanium, zinc sulphide, zinc selenide, gallium arsenide, diamond, gallium phosphide, sapphire and the following metal halides: sensor window materials of more than 40 mm diameter for zirconium fluoride and hafnium fluoride.
TABLE - DEPOSITION TECHNIQUES – NOTES
10. Category 2 does not include "technology" for single-step pack cementation of solid aerofoils.
11. 'Polymers', as follows: polyimide, polyester, polysulphide, polycarbonates and polyurethanes.
12. 'Modified zirconia' refers to additions of other metal oxides (e.g., calcia, magnesia, yttria, hafnia, rare earth oxides) to zirconia in order to stabilise certain crystallographic phases and phase compositions. Thermal barrier coatings made of zirconia, modified with calcia or magnesia by mixing or fusion, are not included.
13. 'Titanium alloys' refers only to aerospace alloys having an ultimate tensile strength of 900 MPa or more measured at 293 K (20°C).
14. 'Low-expansion glasses' refers to glasses which have a coefficient of thermal expansion of 1 x 10⁻⁷ K⁻¹ or less measured at 293 K (20°C).
15. 'Dielectric layers' are coatings constructed of multi-layers of insulator materials in which the interference properties of a design composed of materials of various refractive indices are used to reflect, transmit or absorb various wavelength bands. Dielectric layers refers to more than four dielectric layers or dielectric/metal "composite" layers.
16. 'Cemented tungsten carbide' does not include cutting and forming tool materials consisting of tungsten carbide/(cobalt, nickel), titanium carbide/(cobalt, nickel), chromium carbide/nickel-chromium and chromium carbide/nickel.
17. "Technology" for depositing diamond-like carbon on any of the following is not included:
magnetic disk drives and heads, equipment for the manufacture of disposables, valves for faucets, acoustic diaphragms for speakers, engine parts for automobiles, cutting tools, punching-pressing dies, office automation equipment, microphones, medical devices or moulds, for casting or moulding of plastics, manufactured from alloys containing less than 5% beryllium.
18. 'Silicon carbide' does not include cutting and forming tool materials.
19. Ceramic substrates, as used in this entry, does not include ceramic materials containing 5% by weight, or greater, clay or cement content, either as separate constituents or in combination.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table are defined as follows:
a. Chemical Vapour Deposition (CVD) is an overlay coating or surface modification coating process wherein a metal, alloy, "composite", dielectric or ceramic is deposited upon a heated substrate. Gaseous reactants are decomposed or combined in the vicinity of a substrate resulting in the deposition of the desired elemental, alloy or compound material on the substrate. Energy for this decomposition or chemical reaction process may be provided by the heat of the substrate, a glow discharge plasma, or "laser" irradiation.
N.B.1. CVD includes the following processes: directed gas flow out-of-pack deposition, pulsating CVD, Controlled Nucleation Thermal Deposition (CNTD), plasma enhanced or plasma assisted CVD processes.
N.B.2. Pack denotes a substrate immersed in a powder mixture.
N.B.3. The gaseous reactants used in the out-of-pack process are produced using the same basic reactions and parameters as the pack cementation process, except that the substrate to be coated is not in contact with the powder mixture.
b. Thermal Evaporation-Physical Vapour Deposition (TE-PVD) is an overlay coating process conducted in a vacuum with a pressure less than 0.1 Pa wherein a source of thermal energy is used to vaporize the coating material. This process results in the condensation, or deposition, of the evaporated species onto appropriately positioned substrates.
The addition of gases to the vacuum chamber during the coating process to synthesize compound coatings is an ordinary modification of the process.
The use of ion or electron beams, or plasma, to activate or assist the coating's deposition is also a common modification in this technique. The use of monitors to provide in-process measurement of optical characteristics and thickness of coatings can be a feature of these processes.
Specific TE-PVD processes are as follows:
1. Electron Beam-Physical Vapour Deposition (EB-PVD) uses an electron beam to heat and evaporate the material which forms the coating;
2. Ion Assisted Resistive Heating PVD employs electrically resistive heating sources in combination with impinging ion beam(s) to produce a controlled and uniform flux of evaporated coating species;
3. "Laser" Vaporization uses either pulsed or continuous wave "laser" beams to vaporize the material which forms the coating;
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
b. 4. Cathodic Arc Deposition employs a consumable cathode of the material which forms the coating and has an arc discharge established on the surface by a momentary contact of a ground trigger. Controlled motion of arcing erodes the cathode surface creating a highly ionized plasma. The anode can be either a cone attached to the periphery of the cathode, through an insulator, or the chamber. Substrate biasing is used for non line-of-sight deposition;
N.B. This definition does not include random cathodic arc deposition with non-biased substrates.
5. Ion Plating is a special modification of a general TE-PVD process in which a plasma or an ion source is used to ionize the species to be deposited, and a negative bias is applied to the substrate in order to facilitate the extraction of the species from the plasma. The introduction of reactive species, evaporation of solids within the process chamber, and the use of monitors to provide in-process measurement of optical characteristics and thicknesses of coatings are ordinary modifications of the process.
c. Pack Cementation is a surface modification coating or overlay coating process wherein a substrate is immersed in a powder mixture (a pack), that consists of:
1. The metallic powders that are to be deposited (usually aluminium, chromium, silicon or combinations thereof);
2. An activator (normally a halide salt); and
3. An inert powder, most frequently alumina.
The substrate and powder mixture is contained within a retort which is heated to between 1,030 K (757°C) and 1,375 K (1,102°C) for sufficient time to deposit the coating.
d. Plasma Spraying is an overlay coating process wherein a gun (spray torch) which produces and controls a plasma accepts powder or wire coating materials, melts them and propels them towards a substrate, whereon an integrally bonded coating is formed. Plasma spraying constitutes either low pressure plasma spraying or high velocity plasma spraying.
N.B.1. Low pressure means less than ambient atmospheric pressure.
N.B.2. High velocity refers to nozzle-exit gas velocity exceeding 750 m/s calculated at 293 K (20°C) at 0.1 MPa.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
e. Slurry Deposition is a surface modification coating or overlay coating process wherein a metallic or ceramic powder with an organic binder is suspended in a liquid and is applied to a substrate by either spraying, dipping or painting, subsequent air or oven drying, and heat treatment to obtain the desired coating.
f. Sputter Deposition is an overlay coating process based on a momentum transfer phenomenon, wherein positive ions are accelerated by an electric field towards the surface of a target (coating material). The kinetic energy of the impacting ions is sufficient to cause target surface atoms to be released and deposited on an appropriately positioned substrate.
N.B.1. The Table refers only to triode, magnetron or reactive sputter deposition which is used to increase adhesion of the coating and rate of deposition and to radio frequency (RF) augmented sputter deposition used to permit vaporisation of non-metallic coating materials.
N.B.2. Low-energy ion beams (less than 5 keV) can be used to activate the deposition.
g. Ion Implantation is a surface modification coating process in which the element to be alloyed is ionized, accelerated through a potential gradient and implanted into the surface region of the substrate. This includes processes in which ion implantation is performed simultaneously with Electron Beam-Physical Vapour Deposition (EB-PVD) or sputter deposition.
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
It is understood that the following technical information, accompanying the table of deposition techniques, is for use as appropriate.
1. Technical information for pretreatments of the substrates listed in the Table, as follows:
a. Chemical stripping and cleaning bath cycle parameters, as follows:
1. Bath composition
a. For the removal of old or defective coatings, corrosion product or foreign deposits;
b. For preparation of virgin substrates;
2. Time in bath;
3. Temperature of bath;
4. Number and sequences of wash cycles;
b. Visual and macroscopic criteria for acceptance of the cleaned part;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:
a. Composition of the atmosphere;
b. Pressure of the atmosphere;
2. Temperature for heat treatment;
3. Time of heat treatment;
d. Substrate surface preparation parameters, as follows:
1. Grit blasting parameters, as follows:
a. Grit composition;
b. Grit size and shape;
c. Grit velocity;
2. Time and sequence of cleaning cycle after grit blast;
3. Surface finish parameters;
4. Application of binders to promote adhesion;
e. Masking technique parameters, as follows:
1. Material of mask;
2. Location of mask;
2. Technical information for in situ quality assurance techniques for evaluation of the coating processes listed in the Table, as follows:
a. Atmosphere parameters, as follows:
1. Composition of the atmosphere;
2. Pressure of the atmosphere;
b. Time parameters;
c. Temperature parameters;
d. Thickness parameters;
e. Index of refraction parameters;
f. Control of composition;
3. Technical information for post deposition treatments of the coated substrates listed in the Table, as follows:
a. Shot peening parameters, as follows:
1. Shot composition;
2. Shot size;
3. Shot velocity;
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
3. b. Post shot peening cleaning parameters;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:
a. Composition of the atmosphere;
b. Pressure of the atmosphere;
2. Time-temperature cycles;
d. Post heat treatment visual and macroscopic criteria for acceptance of the coated substrates;
4. Technical information for quality assurance techniques for the evaluation of the coated substrates listed in the Table, as follows:
a. Statistical sampling criteria;
b. Microscopic criteria for:
1. Magnification;
2. Coating thickness uniformity;
3. Coating integrity;
4. Coating composition;
5. Coating and substrates bonding;
6. Microstructural uniformity;
c. Criteria for optical properties assessment (measured as a function of wavelength):
1. Reflectance;
2. Transmission;
3. Absorption;
4. Scatter;
5. Technical information and parameters related to specific coating and surface modification processes listed in the Table, as follows:
a. For Chemical Vapour Deposition (CVD):
1. Coating source composition and formulation;
2. Carrier gas composition;
3. Substrate temperature;
4. Time-temperature-pressure cycles;
5. Gas control and part manipulation;
b. For Thermal Evaporation-Physical Vapour Deposition (TE-PVD):
1. Ingot or coating material source composition;
2. Substrate temperature;
3. Reactive gas composition;
4. Ingot feed rate or material vaporisation rate;
5. Time-temperature-pressure cycles;
6. Beam and part manipulation;
7. "Laser" parameters, as follows:
a. Wave length;
b. Power density;
c. Pulse length;
d. Repetition ratio;
e. Source;
TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
5. c. For Pack Cementation:
1. Pack composition and formulation;
2. Carrier gas composition;
3. Time-temperature-pressure cycles;
d. For Plasma Spraying:
1. Powder composition, preparation and size distributions;
2. Feed gas composition and parameters;
3. Substrate temperature;
4. Gun power parameters;
5. Spray distance;
6. Spray angle;
7. Cover gas composition, pressure and flow rates;
8. Gun control and part manipulation;
e. For Sputter Deposition:
1. Target composition and fabrication;
2. Geometrical positioning of part and target;
3. Reactive gas composition;
4. Electrical bias;
5. Time-temperature-pressure cycles;
6. Triode power;
7. Part manipulation;
f. For Ion Implantation:
1. Beam control and part manipulation;
2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles;
g. For Ion Plating:
1. Beam control and part manipulation;
2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles;
5. Coating material feed rate and vaporisation rate;
6. Substrate temperature;
7. Substrate bias parameters.
[1] ^(*) The Russian Federation and Ukraine view this list as a reference list drawn up to help in the selection of dual-use goods which could contribute to the indigenous development, production or enhancement of conventional munitions capabilities.
[2] ^(*) The Russian Federation and Ukraine view this list as a reference list drawn up to help in the selection of dual-use goods which could contribute to the indigenous development, production or enhancement of conventional munitions capabilities.
[3] ^(*) The numbers in parenthesis refer to the Notes following this Table.